Toshiba designs BG SSDs with BiCS flash memory

Toshiba designs BG SSDs with BiCS flash memory

Toshiba has achieved a major tech breakthrough – the Japanese company will announce a new generation solid-state drives at the 2016 Flash Memory Summit that will take place August 8 – 11. The new SSDs are based on cutting-edge BiCS flash memory with 3-bit-per-cell TLC technology and feature Toshiba’s new single-package ball grid array (BGA) NVMe PCIe Gen3 package.

The main new features of the new SSD generation include a small form factor, very low power consumption and improved performance. All these features make the new SSDs perfect for ultrabooks, notebooks, convertibles and other digital devices. The Toshiba BG SSDs have a surface area that is 95 per cent smaller than conventional 2.5-inch SATA storage devices and 82 per cent smaller than M.2 Type 22806 drives and combine both the controller and NAND flash memory in a single 16 mm x 20 mm BGA package. Thanks to the usage of BiCS flash memory the BG series provides capacities of up to 512 GB in a compact and power efficient form factor.

“We are thrilled to unveil the new BG series with BiCS FLASH which will deliver both a rich feature-set and high performance all within an extremely small footprint and power profile,” said Jeremy Werner, vice president of SSD marketing and product planning at Toshiba America Electronic Components, Inc. “We expect to be in production this year with BiCS FLASH BGA SSDs, offering our customers a compelling and cost-effective storage solution for the next generation of high performance ultra-thin and light notebooks and tablets.”

The new Toshiba BG SSD family will include three models with capacities of 128 GB, 256 GB and 512 GB in a 16 mm x 20 mm package (M.2 Type 1620) or a removable M.2 Type 2230 module. The first samples of these solid-state drives will become available in Q4 2016.

Source: Toshiba

Related posts

Samsung Galaxy S III could be 7 mm thick

Sources close to Samsung have indicated that the new Samsung Galaxy S III that is expected to be launched later this year will be just 7 mm thick. In addition the insiders have revealed that the new smartphone is expected as early as May 2012. The new Samsung Galaxy S III will be the apex...

SteelSeries intros Adapter for mobile devices

SteelSeries, the leading manufacturer of gaming peripherals and accessories, today introduced the SteelSeries Adapter for mobile devices. Designed to be used with any PC Headset, such as the new Siberia v2, the SteelSeries Adapter can be used with most mobile devices with a 3.5 mm adapter such...

NEC introduces 70-inch P701 LCD Display

NEC adds  70-inch giant to its P Series  LCD display for digital signage.  The P701 commercial-grade display touts more than 30 built-in features in its Enhanced Digital Signage Technology Suite offers full HD resolution , 2000:1 contrast ratio and full connectivity, including DisplayPort and...

Leave a comment