AMD reveals two new complete platforms for Embedded Systems

At Embedded Systems Conference today, AMD  announced two new complete platforms for the embedded market, the compact ASB2 platform and the high-performance AM3 platform, that offer myriad combinations of power and performance with up to 74 percent improvement in performance-per-watt over previous generations. AMD’s new flexible embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W TDP for the ideal solution based on application requirements. System designers focusing on their next-generation products can see immediate benefits commonly associated with industry-standard x86 processors, including streamlined design and development, a large software ecosystem, and fast time-to-market.

“The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon,” said Buddy Broeker, director, Embedded Solutions Division, AMD. “AMD’s embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past. Our commitment to the embedded market grows stronger as we look to a future introduction of AMD Fusion™ technology products into the embedded space.”

Embedded industry leaders support the benefits of AMD’s approach to x86 and complete platform solutions in the market. Read what customers iBASE and Quixant have to say about AMD Embedded Solutions.

New Platform Features

  • Faster memory with support for 2 channels DDR3
  • Improved I/O for high-throughput and real-time applications with available HyperTransport™ 3.0 technology
  • ECC for high-reliability applications like SMB/SOHO storage systems
  • Multiple CPU options that offer wide choice of performance and power
    • Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
    • Single-, dual- and quad-core
    • Up to 2.8 GHz
  • AMD 785E chipset with support for PCI Express® 2.0
  • New ATI Radeon™ HD 4200 graphics with DirectX® 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
  • Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
  • Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs

Source: AMD

Related posts

LiteOn releases S900 solid-state drive line

LiteOn releases S900 solid-state drive line

The Taiwanese company LiteOn has released a new solid-state drive line known as S900. The new line has three models as of now with capacities of 64 GB, 128 GB and 256 GB and supports the latest SATA 3.0 standard. Each S900 SSD measures 100 x 69.85 x 6.8 mm and weighs 56 grams. The drives also...

VAIO debuts two new notebook lines for professionals

VAIO debuts two new notebook lines for professionals

VAIO is a brand name that you may still associate with Sony but the truth is that nowadays VAIO has nothing to do with the famous Japanese company. Some time ago Sony sold the brand name due to poor sales results so a new company with the same name was born. Despite the change VAIO kept on...

Traffic Rider

Traffic Rider

We haven’t reviewed a racing game in quite a while so here’s one. Called Traffic Rider this free app for Android will bring you some adrenaline due to the high highway speeds that you will get to experience. The game comes with tons of features and this is why it measures around 90 MB in...

Leave a comment