First SuperSpeed USB Interoperability Demonstrated
Yesterday at the USB Implementers Forum SuperSpeed USB Developers Conference in Tokyo, multiple companies demonstrated interoperable prototype hosts and devices, furthering significant market momentum for SuperSpeed USB.
Companies including Fresco Logic, Fujitsu Microelectronics Limited, LucidPort Technology, Inc. and NEC Electronics Corporation showcased interoperable prototype PC hosts and peripheral devices using prototype software from Intel Corporation to seamlessly transport SuperSpeed USB traffic. Today marked the first public SuperSpeed USB interoperability demonstration, using PC hosts and storage devices from multiple companies.
The USB 3.0 specification was completed and released in November 2008, marking the beginning of SuperSpeed USB product development efforts. SuperSpeed USB brings significant power and performance enhancements to the popular USB standard while offering backward compatibility with billions of USB-enabled PCs and peripheral devices currently in the market. Delivering data transfer rates up to 10x faster than Hi-Speed USB (USB 2.0) as well as optimized power management, SuperSpeed USB is the next generation of ubiquitous USB technology.
“The fact that companies are already demonstrating interoperable SuperSpeed USB solutions underscores the intense interest and market need for this technology,” said Jeff Ravencraft, USB-IF president and chairman. “The combination of market-leading data transfer speeds, improved power efficiency and backward compatibility with the billions of USB devices has resulted in excitement from silicon vendors, electronics manufacturers and consumers alike.”
SuperSpeed USB demonstrations at the event included a Fresco Logic prototype PC host working with a mass storage device from Fujitsu. In another demonstration, NEC Electronics Corporation featured a PC host transferring data to a mass storage device from LucidPort. The USB-IF anticipates SuperSpeed USB products will be available for consumers to purchase in early 2010.
“SuperSpeed USB comes at a time when larger data files and improved device storage capabilities demand faster data-transfer technologies,” said Shane Rau, Program Director of IDC’s Computing, Networking, and Storage Semiconductors Group. “IDC forecasts that SuperSpeed USB, with 10x the theoretical maximum transfer speed of USB 2.0 and improved power management capabilities, will ship in 45 percent of mobile PCs in 2012.”
The SuperSpeed USB Developers Conference provides attendees with an opportunity to hear directly from the creators of the USB 3.0 specification. Keynote speakers will address the new SuperSpeed USB architecture, performance enhancements and power efficiency and what that means for companies developing SuperSpeed USB solutions.
To access the Tokyo SuperSpeed USB Developer Conference press kit, please visit: http://www.usb.org/press/tokyodevcon
For more information about SuperSpeed USB or the USB 3.0 specification, please visit http://www.usb.org/.