G.Skill outs 2,000MHz DDR3 memory modules with Flare heatsinks for AMD platform

G.Skill International Co. Ltd., manufacturer of extreme performance memory and high performance solid-state storage, has today launched the 2,000MHz CL7-9-7-24 1.65V 4GB (2GBx2) DDR3 kit with its latest Flare heatsinks, as the ideal performance partner for AMDs latest 6-core processors.

G.Skill’s Flare series has represented high-performance memory modules for the AMD platform since its first exposure in Cebit 2010, and G.Skill continues its enthusiast commitment in the platform. Now the Flare family brings 2,000MHz to the world of AMD, with the incredible timing of CL7. It provides AMD enthusiasts the perfect choice of high-end memory to make the most of overclocking the latest AMD system. This kit has passed the usual series of strict internal testing here at G.Skill, with validation currently on ASUS’ M4A89TD PRO motherboard (AMD 890FX chipset) to absolutely ensure compatibility, stability and performance.

G.Skill Flare DDR3

“Here in the G.Skill R&D team, we are yet again continuing to lead the way and produce the best performance memory modules for our customers. After some significant effort and help from our partners, we are very glad to finally launch DDR3 2,000 MHz Cl7 kits for AMD enthusiasts.” commented Tony Chou, Senior R&D manager at G.Skill.

Source: G.Skill

Related posts

Be Quiet! adds new model to Dark Rock line

Be Quiet! adds new model to Dark Rock line

The German cooling solutions maker Be Quiet! has added a new CPU cooler to its Dark Rock line. The new cooler is called Dark Rock TF and offers a top-flow format, a sophisticated design and the efficiency of the proven SilentWings technology to cool systems with compact form factors. The new...

 How about that 2017 Toyota Rav4?

 How about that 2017 Toyota Rav4?

What a great car! It’s been around since the mid-nineties and is still one of the most popular compact crossover SUVs on the market today. The Rav4 was created for people who wanted all that SUVs had to offer, such as high visibility, large cargo area and optional four-wheel drive, as well as...

Samsung Develops Thinnest ulti-die Memory Package

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is...

Leave a comment