OCZ unveils High-Density 4GB DDR3 at 2133 MHz memory kits

OCZ comes up with new high-speed 4GB (4096MB) modules,  aimed at gamers and performance enthusiasts. The kits are available in either 8GB dual channel or 12GB triple channel kits from their Flex EX,  Reaper HPC and Platinum Series momory, working at 2133MHz.


The 4GB modules operate at 1.65V and as OCZ claims “are tested and qualified on the latest AMD and Intel platforms to ensure ultimate performance and stability”. They comes with lifetime warranty and is expected to be available soon.

OCZ Reaper HPC and Flex series DDR3 memory

“Usually high speed and high density don’t go hand in hand, but our newly introduced high density 2133MHz memory solutions are engineered to do exactly that,” said Alex Mei, CMO at the OCZ Technology Group. “Designed for more than just raw speed, these new kits deliver an excellent blend of performance, density and reliability for a wide range of applications ranging from rendering video to smoother gameplay on the latest titles.”

OCZ Platinum DDR3


Related posts

Xigmatek to sell Praeton LD964s CPU cooler

The Taiwanese maker of cooling solutions Xigmatek plans to release a new CPU cooler – the Praeton LD964s. The new company product is a cheap solution and is a low-profile product. It measures 104 x 83 x 44 mm and comes with an aluminum heat sink, four 6 mm nickel-plated...

New pictures of Samsung Galaxy F smartphone

New pictures of Samsung Galaxy F smartphone

Information on the Samsung Galaxy F smartphone has been circulating on the Internet for quite some time but pictures of the upcoming device have been leaked just now. Judging by them the upcoming smartphone will have a thin metallic chassis but a version with a plastic chassis is also to be...

AMD Bristol Ridge tech specs published online

AMD Bristol Ridge tech specs published online

AMD’s upcoming Zen processors will be the most interesting chips that will come out of the US company but until they appear we will have to do with the so-called Bristol Ridge APUs. The chips are expected this spring and little by little we get to know things about them – the preliminary specs...

Leave a comment