AMD unveils new embedded graphics solutions

AMD unveils new embedded graphics solutions

Advanced Micro Devices (AMD) has unveiled a number of new embedded Radeon graphics solutions that are suitable for multiple form factors. The new AMD products are designed to improve the visual and parallel processing capabilities of embedded applications and represent continued AMD commitment to embedded market innovation.

The new AMD embedded graphics solutions offer various new features and performance levels from 192 GFLOPS to 3 TFLOPS of single precision power and 20-95W of thermal design power (TDP). The products are offered as a Multi-Chip Module (MCM), Mobile PCI Express Module (MXM) and PCIe options, with AMD offering the only MCM solutions.

“The demand for rich, vibrant graphics in embedded systems is greater than ever before, and that demand is growing,” said Scott Aylor, corporate vice president and general manager, AMD Embedded Solutions. “Our latest additions to the embedded product lineup help designers build mesmerizing user experiences with 4K multi-screen installations and 3-D and interactive displays. In addition, the powerful capabilities of our GPUs can address the toughest parallel compute challenges.”

The new AMD graphics solutions cover three levels of performance – ultra-high, high and power efficient. The AMD Embedded Radeon E8950MXM Module is tasked with covering the ultra-high end market, while the AMD Embedded Radeon E8870 Series (MXM and PCIe) and AMD Embedded Radeon E6465 Series (MCM, MXM and PCIe) cover the high performance and power efficient market segments by offering high performance for virtually any embedded application and excellent processing performance at low levels of power consumption, respectively.

The AMD Embedded Radeon E8950MXM module is designed for GPGPU computing and 4K applications and is perfect for casino and arcade gaming machines, military equipment and medical imaging devices. The Radeon E8950MXM is small enough to fit in systems with small space requirements and includes 32 compute units with up to 3 TFLOPS of single precision performance, 8 GB of GDDR5 memory, a 256-bit memory bus, less than 95W TDP, and AMD Eyefinity technology for up to 6 display outputs. The Radeon E8950MXM also supports 4K hardware-accelerated decoding and encoding, DirectX 12, OpenGL 4.5 and OpenCL 2.0.

The high performance AMD Embedded Radeon E8870MXM and E8870PCIe solutions offer 12 compute units, 1.5 TFLOPS of single-precision power (peak), 4 GB of GDDR5 memory, a 128-bit memory bus, less than 75W TDP, AMD Eyefinity technology for up to 6 display outputs, dual HD decode of H.264, VC-1, MPEG-4 and MPEG-2 and support for DirectX 12, OpenGL 4.5 and OpenCL 2.0.

The AMD Embedded Radeon E6465 Series (MCM, MXM and PCIe) offer excellent power efficiency, hidden in 2 compute units. The chips in the line also offer a peak single-precision performance level of 192 GFLOPS, 2 GB of GDDR5 memory, a 64-bit memory bus, less than 20W of TDP, dual HD decode of H.264, VC-1, MPEG-4 and MPEG-2 and support for DirectX 11.1, OpenGL 4.5 and OpenCL 1.2.

There’s no word on pricing but all new AMD embedded solutions are compatible with Windows 7, Windows 8.1, Windows 10 and Linux.

Source: AMD

Related posts

FSP debuts Hydro X power supply units

FSP debuts Hydro X power supply units

About two months after FSP announced its new Hydro line of power supply units, the Taiwanese company is back with an updated line called Hydro X. The new PSUs are improved versions of the Hydro power supplies, which were released back in March. While the original Hydro PSUs come with 80 Plus...

Samsung Galaxy S III to get Jelly Bean next month

The Samsung Galaxy S III is perhaps the finest smartphone nowadays but there’s a small problem with it – it does not come with the latest Android version – Jelly Bean. Samsung representatives have confirmed though that the European version of the Galaxy S III will get an update...

Sony's new 13.3-inch VAIO S Series notebooks

Sony presents its renewed ultraportable 13.3-inch VAIO S line notebooks, featuring a new ‘full flat’ design with a wide aluminium palmrest, concealed hinge and overall thickness less than 24mm with weight of 1.75kg. The new 13.3” (33.7cm) VAIO S has magnesium casing and packs Display Plus LCD...

Leave a comment