AMD works on dual-GPU R9 290X graphics card

As it usually happens with every new graphics card generation a new dual-GPU video card is headed our way because as we know two is always more than one, besides the manufacturer will make some more money. Anyway the new expected dual-GPU solution will be known as AMD Radeon R9 290X and will carry the Vesuvius code name.

The new video solution is expected to come with 5632 stream processors, 352 texture units, 256 ROPs, 8 geometry processors, 16 asynchronous compute engines, 2 MB of L2 cache, a 1024-bit memory bus and other performance boosting technologies. The upcoming AMD product is expected to feature never before seen graphics performance that will eclipse the already withdrawn dual-GPU GeForce GTX 690 and Radeon HD 7990 graphics cards.

There’s no information on the official release date of the graphics card and pricing is also a mystery. One thing is known for sure though – the card will not be cheap at all.


Source: X-Bit Labs

Related posts

AnTuTu leaks some Galaxy S6 Edge tech specs

AnTuTu leaks some Galaxy S6 Edge tech specs

The popular AnTuTu smartphone benchmarking software has once again leaked the tech specs of an upcoming smartphone. The story now is more interesting than ever, though, as it covers the tech specs of the upcoming curved Samsung Galaxy S6 Edge smartphone. According to the leaked information...

Auzentech Releases X-Raider 7.1 and X-Studio 5.1 Sound Cards

Auzentech, Inc  announced today the immediately availability of the Auzen X-Raider 7.1 and X-Studio 5.1 Sound Cards. These sound cards provide an affordable upgrade from the onboard audio built into desktop PCs, and are ideal for improving audio from games, music, and movies. The Auzen...

Samsung starts production of first 3D TSV DDR4 memory modules

Samsung starts production of first 3D TSV DDR4 memory modules

The famous Korean technology company Samsung has started mass production of the industry’s first 64 GB DDR4 registered dual-inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. The new memory modules are designed for use with enterprise...

Leave a comment