CPU thermal paste may be coming to its end

Serious overclockers and PC enthusiasts alike are fully aware of the importance of the thermal paste used on all modern processors. Usually a type of white goo the thermal paste improves heat dissipation between the CPU and the CPU cooler and helps reduce the processor temperature, which makes it mandatory on all high-performance processors of today.

Sony, however, has prepared something better that may spell the end of the traditional CPU thermal paste. The Japanese tech giant has prepared the so-called “thermal sheets” that may succeed the well-known thermal paste. Known so far as EX20000C the sheets offer a thermal resistance of 0.4-0.2K cm2/W and a compressive load of about 1-3kgf/cm2 all for 0.3-2.0 mm of thickness with this combination being five or six times more effective than previous generations of thermal paste developed by Sony.

AMD processor

The new thermal sheets are far from being ready but Sony says they can shave off 3 degrees of temperature compared to “traditional” thermal paste although the tech giant failed to mention what type of thermal paste the testers used. As most of us known there’s thermal paste and thermal paste and the most expensive and efficient types can reduce the CPU temperature by up to six degrees.

The thermal sheets also come with an important improvement – they are not as messy as traditional thermal paste so you won’t get your hands dirty anymore while risking short-circuiting your CPU.

Sony expects that the first commercial thermal sheets will find use in servers at first. Later down the road they may find use in everyone’s PC, although right now this isn’t for sure.


Source: Eteknix.com

Related posts

Intel to use 32-layer 3D NAND flash chips

Intel to use 32-layer 3D NAND flash chips

Intel has announced it will use 32-layer 3D NAND flash chips from now on. While this might not seem like important news, in reality it is as it will have long-term consequences for the chip maker as well as consumers. One good outcome is that this technology will allow Intel to build solid-state...

LG confirms some G4 smartphone specs

LG confirms some G4 smartphone specs

The LG Innotek branch of LG, which produces components for LG smartphones, has confirmed some of the tech specs of the upcoming LG G4 high-end smartphone. The new handset will include an f/1.8 camera and a 16 MP image sensor that goes with it. In addition the smartphone will have an 8 MP front...

Seagate ships world’s fastest 6 TB hard drive

Seagate ships world’s fastest 6 TB hard drive

The famous US hard drive maker Seagate has announced that shipments of its Seagate Enterprise Capacity 3.5 HDD v4 have commenced. The company claims this is the world’s fastest enterprise hard drive with capacity of 6 TB and a look at the specs suggests that this is true. “Unstructured data...

Leave a comment