GeForce GTX 670 Ti rumoured specs surface on the Net

The recently launched GeForce GTX 680 stealed the show – there’s no doubt about it. Powerful, yet amazingly energy efficient, the new graphics card eclipsed the Radeon HD 7970, launched last December, and conquered the hearts of most gamers.

Everything seems rosy except for one thing – the hefty 500+ USD you have to pay in order to get one. Not that many people are willing to part with five 100 USD bills, especially amidst an economic crisis, so NVIDIA was forced to work faster on a more budget-friendly yet speedy graphics card – please meet the GeForce GTX 670 Ti.

Based on the Kepler architecture, the novelty will surely hit the market later this year so there’s not much to do nowadays but wait for it. Still rumoured specs of the upcoming GeForce GTX 670 Ti have been circulating on the Web giving a hint as to what the card will look like.

Nvidia GeForce Logo

Specs-wise the GTX 670 Ti will be based on the same GK104 core, found in the high-end GTX 680, but it will come with one of the eight streaming multiprocessors (SMX) disabled – presumably due to manufacturing defects. Each SMX rocks 192 CUDA cores, so a seven SMX-sporting GTX 670 Ti would have 1344 cores.

In addition to the reduced number of cores the GTX 670 Ti will sport 4 graphics processing clusters, 112 texture units, 32 raster units and 2 GB of GDDR5 memory, accessed via a 256-bit bus. The graphics core will operate at 900 MHz, while the memory will be clocked at 1250 MHz (5000 MHz effective clock speed).

The GeForce GTX 670 Ti is expected to debut sometime in May, which will give NVIDIA enough time to stockpile enough defective GK104 cores. Price-wise the GTX 670 Ti is expected to fall between the 350 USD and 400 USD price range.

Source: MaximumPC

Related posts

AMD introduced ATI Radeon E4690 Mobile PCI Express module

At the DIGITIMES Tech Forum (DTF) 2010, AMD  today introduced the ATI Radeon™ E4690 Mobile PCI Express module (MXM) for the graphics-intensive embedded systems. The industry-standard MXM 3.0 specification for graphics subsystems calls for reduced power, improved cooling capability and a lower...

Samsung to offer Galaxy S III with a new design

Believe it or not a large number of potential smartphone buyers did not like the design of the Samsung Galaxy S III when it was revealed a few weeks ago. This customer feedback has prompted Samsung to come up with a new design for its smartphone flagship. So here we get the same...

Chinese iPhone 6 Plus customers can now enlarge their pockets

Chinese iPhone 6 Plus customers can now enlarge their pockets

The iPhone 6 and iPhone 6 Plus have definitely become the best selling smartphones of summer/fall 2014. The devices have attracted the attention of millions of people around the world so not surprisingly they sold (and are still selling) like hotcakes. Unfortunately for many people the large...

Leave a comment