Intel shares some more details on new Xeon Phi processors

Intel shares some more details on new Xeon Phi processors

The famous US chip maker Intel has shared some more information on its upcoming Knights Landing processors at the on-going International Supercomputing Conference in Leipzig, Germany. According to the information released the new Xeon Phi generation will use some interesting technologies that we will detail here.

The first thing worth mentioning is that the new Knights Landing chips will use a new interconnect technology that eliminates some bottlenecks that have hindered the evolution to exascale computing. In addition to that the new chip will be available as a standalone processor directly installed in a motherboard, something which was not true for its predecessor. The chip will include up to 16 GB of high speed and high bandwidth memory that is said to deliver up to five times better bandwidth when compared to DDR4 memory, five times better energy efficiency and three times more density when compared to current GDDR-based memory. If system builders prefer, Intel will be supplying Knights Landing and Intel Omni Scale Fabric controllers as PCIe-based add-on cards.

The latest known features are that Knights Landing will use Intel’s upcoming state-of-the-art 14 nm tech process and that it will have more than 60 HPC-enhanced Silvermont architecture-based cores. Support for DDR4 memory will also be provided.

Knights Landing will be available in HPC systems starting in H2 2015.

Source: Intel

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