Leak confirms AMD Fiji will be the first card with stacked HBM
A leak coming from the web site of the upcoming Hot Chips 2016 symposium, scheduled for August 23-25, 2015, has confirmed that the upcoming AMD Fiji graphics card will be the first 3D card ever with stacked high bandwidth memory (HBM). The other confirmation in this piece of information is that the AMD flagship is indeed called Fiji.
Don’t look for the leak on Hot Chips’ web site as it is no longer there but when it was it described a presentation called “Fiji, The World’s First Graphics Processor With 2.5D High Bandwidth Memory”. The presentation will be conducted by AMD’s Joe Macri and Raja Koduri both of whom are big AMD GPU veteran engineers who were responsible for crafting AMD’s and before then ATi’s GPU architectures. They will be joined by Mike Mantor and Bryan Black who happens to be AMD’s head of the die stacking program – he talked about this technology back in 2012.
Hot Chips is a symposium on high performance processors, which takes place every year in August, where various high tech companies present deep and detailed overviews on recently launched products. This means that Fiji will appear before August of this year as AMD has always spoken of products that have been already announced.