Qualcomm announces three new SoCs
Soon after announcing the Snapdragon Wear 2100, Qualcomm has also announced three new SoC chips for smartphones and tablets. The processors are called Snapdragon 625, Snapdragon 435 and Snapdragon 425. An interesting fact is that a chip called Snapdragon 425 was announced last year but the new one has nothing in common with its predecessor.
The new Snapdragon 425 SoC comes with four Cortex-A53 cores that run at 1.4 GHz and Adreno 308 graphics. There’s no information on the Adreno 308 GPU but we can suppose that this is an Adreno 304/305 GPU with a higher GPU clock. The chip comes with an integrated X6 LTE modem that can transfer data at up to 150 Mbit/sec, a Wi-Fi 802.11ac chip, Bluetooth 4.1, a Qualcomm RF360 frequency block and a Hexagon 536 signal processor. The SoC supports displays with resolutions of up to 1280 x 720 pixels, cameras with up to 16 MP of resolution, LPDDR3 memory up to 667 MHz, eMMC 5.1 memory and Quick Charge 2.0 technology. The chip will be made on 28 nm process technology.
The Snapdragon 435 SoC includes eight Cortex-A53 cores at 1.4 GHz and Adreno 505 graphics. The chip will replace the Snapdragon 615/616/617 processors and to do that it includes an X8 LTE modem (up to 300 Mbit/sec), support for LPDDR3 memory at 800 MHz, UHS-I flash memory, HD resolution displays, 21 MP cameras and Quick Charge 2.0 technology.
The Snapdragon 625 is the most powerful SoC of the three – the chip packs eight Cortex-A53 cores that can run at more than 2 GHz and Adreno 506 graphics. The chip comes with X9 LTE Cat 7 modem (300 Mbit/sec), a Hexagon 546 signal processor and support for cameras at up to 24 MP of resolution, displays with resolutions at up to 1900 x1200 pixels, LPDDR3 memory at 933 MHz, USB 3.0, 4K video recording and playing and more. This chip will be made on 14 nm production process unlike the two other SoCs.
The first devices with Snapdragon 425, Snapdragon 435 and Snapdragon 625 SoCs are expected in H2 2016.