Transcend Introduces DDR3 1333MHz Memory Kit for Intel Core i5 Platforms

Transcend-DDR3-1333MHz--TS1333KLU-4GKTranscend Information Inc. , a leading global manufacturer of memory modules, today announced shipping of a new DDR3 1333MHz memory module kit designed for Intel’s latest LGA1156 Core i5 and Core i7 platforms.

The DDR3 1333MHz dual-channel memory kit is perfectly matched for use with Intel’s next-generation desktop PC platform, Core i5. The new Core i5, which is based on Intel’s new Nehalem architecture, is the first Intel processor to integrate both a 16-lane PCI Express 2.0 graphics port and a two-channel DDR3 memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 core-logic.

Transcend DDR3 1333MHz -TS1333KLU-4GK

Transcend’s DDR3 1333MHz memory modules provide high-speed performance at an ultra-low voltage of 1.5V, thus reducing power consumption by 30% compared to DDR2-800 memory. Featuring combined bandwidth up to an incredible 21.3GB/sec, these new modules operate at 1333 MHz with latencies of 9-9-9-24, ensuring full support for the performance improvements offered by Intel’s latest technology.

These new DDR3 memory modules meet rigorous JEDEC (Joint Electronic Device Engineering Council) standards and consist of 128Mx8 high-quality DDR3 FBGA chips. With each module having passed real-world testing on dual-channel platforms, Transcend’s new DDR3 memory offers guaranteed quality, outstanding performance, excellent compatibility, as well as superb reliability and stability.

The kit includes two identically matched DDR3 1333MHz modules and is now available in 4GB (2GBx2) capacity.

Source: Transcend

Related posts

Huawei debuts the Ascend P6S smartphone

The Chinese smartphone maker Huawei has finally announced its high-end P6S smartphone putting an end to all speculation and expectations. The P6S officially measures 132.7 x 65.5 x 6.5 mm and weighs 120 grams. These dimensions are the home of a quad-core processor that runs at 1.6 GHz, a...

Cooler Master announces new notebook cooler

Cooler Master announces new notebook cooler

The well-known maker of cooling solutions Cooler Master has announced the ErgoStand III notebook cooler. The new cooler is designed as a cooling stand and docking station and can serve the needs of up to 17-inch notebooks and mobile tablets. The ErgoStand III comes equipped with a large 230...

Samsung Brings 40-nm Technology to Production of Advanced Fusion Memory – Flex-OneNAND™

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced that it has begun using 40-nanometer (nm) process technology to produce an eight-gigabit (Gb) Flex-OneNAND™ fusion memory chip. Samsung’s Flex-OneNAND is a proprietary memory device that...

Leave a comment