Asus unveils the Padfone – smartphone and tablet combo

2011 is the year of tablets and  from Asus understands that very well. Today at Computex 2011,  Asus has unveiled a very interesting mobile solution that combines a smartphone and a tablet computer into one device, giving new possibilities for mobile computing and communication.


With Asus Padfone  you have actually two devices, a 4.3-inch smartphone which can dock into a 10.1-inch (1280 x 800) tablet. The Padfone allows you to use one SIM card for the both devices, giving you the convenience to use one of them in the appropriate moment and to choose the screen size that best fits your activities while seamlessly sharing data and 3G internet access. It also will allow you seamless transition of applications between pad and phone, and another interesting feature is that you can use the pad as an extended battery to charge your phone.

ASUS Padfone

Specific hardware details haven’t been revealed, nor pricing details or availability, but stay tuned…

Related posts

Sapphire adds HD 5850 TOXIC Edition with 2GB

SAPPHIRE Technology has just announced a new version of its successful HD SAPPHIRE HD 5850 TOXIC Edition with a larger frame buffer size of 2GB. The SAPPHIRE HD 5850 TOXIC series are SAPPHIRE original designs based on the latest 40nm graphics architecture from the ATI division of AMD. They...

MSI announces Skylake generation ECO motherboards

MSI announces Skylake generation ECO motherboards

MSI has announced a new line of environment-friendly motherboards for the Intel Skylake CPU generation. The new boards are based on the H170, B150 and H110 chipsets, have full support for Intel’s 6th generation Core processors and represent the second generation ECO motherboards by MSI. All new...

IBM to manufacture new type of memory

IBM will soon start the production of a new type of memory built on CMOS technology along with the help of the so-called through-silicon via (TSV). TSV is a technology that allows a vertical electrical connection (via) to pass completely through a silicon wafer or die. The improved IBM...

Leave a comment