HTC J Butterfly specs and photos reach the Internet

HTC J Butterfly specs and photos reach the Internet

HTC’s Butterfly line of smartphones will soon include a new model that is known as HTC J Butterfly. The device has been leaked online and now we have information on its tech specs and looks. Judging by them the HTC J Butterfly will be a high-end model but there’s more – it strongly resembles the HTC M8 in a water-proof chassis.

The device measures 146.36 x 70.6 x 10 mm and weighs 156 grams. The chassis is water and dust-proof as it follows all IPX5, IPX7 and IP5X standards. Customers will be treated with a large 5-inch Super LCD 3 display that works at Full HD resolution (1920 x 1080 pixels), 2 GB of RAM, 32 GB of internal memory, 50 GB of free Google Drive storage for 2 years, a microSD card slot (up to 128 GB) and three cameras – one front at 5 MP, one rear at 13 MP and one more at 2 MP. A Qualcomm Snapdragon 801 processor with four cores at 2.3 GHz and Adreno 330 graphics does all the calculations required.

There are numerous connectivity options too – the HTC J Butterfly is expected to support Bluetooth 4.0, 802.11ac Wi-Fi, NFC and more including a GPS receiver. The device is powered by a 2600 mAh battery that can spend 14 days in standby mode. Finally, Android 4.4 KitKat serves as the smartphone OS. As with many other smartphones HTC Sense sits on top of Android.

The expected pricing of the smartphone is unknown.

Source: Engadget.com

Related posts

Specs of Intel Haswell chip leaked

It has been a while since the first details on the upcoming Intel Haswell chip surfaced – we now know it will use the LGA1150 form factor and will offer unseen power efficiency as well as increased performance thanks to architectural tweaks – but no more details on models have surfaced...

MSI launches Wind U160

The Wind U160, MSI's exquisitely designed small notebook PC, which has already won an Germany's iF product design awards and become a major talking point in the IT industry, has been formally launched onto the market! The Wind U160 is less than one inch thick, and weighs just 1 kg. It uses...

AMD may release its AM4 platform in March 2016

AMD may release its AM4 platform in March 2016

AMD has been badly lacking performance in the CPU department for a really long time but things may change in year 2016 when the US company plans to release its new Zen architecture and a number of processors based on it. In addition to the current bad picture competitor Intel sports support for...

Leave a comment