HTC working on One XXL smartphone

The Taiwanese smartphone maker HTC is currently working on a new flagship smartphone, sources on the Internet claim.

The new smartphone is currently known as Closurexxl and a few pictures of it confirmed its existence. The novelty will be known as One XXL when it hits the market and will succeed the HTC XL smartphone. On the outside the new mobile phone will be similar to the HTC One X and HTC One XL but on the inside it will feature some serious improvements.

HTC Logo

The improvements will include a new powerful quad-core Qualcomm Snapdragon S4 APQ8064 processor at 1.6 GHz, 2 GB of RAM and an integrated high-performance Adreno 320 GPU. The HTC One XXL will also come with two cameras – one rear at 8 MP and one front camera at 1.8 MP. Connectivity will be provided by Wi-Fi 802.11b/g/n, Bluetooth 4.0 and LTE. As to the screen – the HTC One XXL will have a 4.7-inch display at 1280 x 720 pixels.

Analysts expect HTC to demonstrate the phone at the upcoming IFA 2012 that will be held in Berlin, Germany in about 2 months. Commercial availability and pricing are unknown, though.


Source: PHP.ru

Related posts

LG to offer one more ultra wide monitor

LG to offer one more ultra wide monitor

The Korean LG will release a new ultra wide monitor sometime in June of this year that will belong to the company’s UltraWide line of monitors. The new company product will be called 27MU67 and will pack a 27-inch display as the name of the device suggests. The upcoming LG 27MU67 ultra wide...

Samsung works on Galaxy Mega On smartphone

Samsung works on Galaxy Mega On smartphone

Samsung is getting ready to release one more smartphone on the market where the device will be known as Galaxy Mega On (codename SM-G6000). The device will be an entry-level phablet for people who cannot spend that much money on the Galaxy Note 5 phablet but there’s a price to pay – the tech...

Samsung Launches 32-Gigabyte Embedded Memory Card Produced with 30nm-class NAND Technology

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNANDTM, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process technology. Use of high-density embedded memory...

Leave a comment