MIT researchers create self-assembling 3D nanostructures

Researchers at MIT have devised a new way of creating self-assembling 3D nanostructures that may change the way computer chips are produced in the future.

Self-assembling structures are not something new – up until now they were made of polymers but the MIT discovery is the first time when multi-layer and configurable layouts have been made – and one day this may be used for creating self-assembled computer chips.

We won’t get too deep into science so here’s a simple explanation – the people at MIT used diblock copolymers – a rather large molecules that are made of two distinct polymers with each of them having different chemical and physical properties. The copolymers then form log cylinders or in other words – wires.

Diblock Copolymers

The significance in the MIT achievement is that scientists can now control exactly how these copolymers arrange. By growing tiny, 10 nm-wide silica “posts” on a silicon substrate, the researchers can control the angles, bends, spacing, and junctions of the copolymer cylinders. Once the grid of posts has been built, the wafer is simply covered in the polymer material, and chip’s wires and junctions self-assemble.

The technology is still in its infancy and surely very much away from making computer chips but the team of scientists hopes that it will be able to produce a simple electronic device by next year.

The successful implementation of the technology in the future will significantly alleviate the production of computer chips while allowing smaller and smaller transistor nodes.


Source: Extremetech

Related posts

nevo smartwatches do not need to be charged

nevo smartwatches do not need to be charged

Smartwatches are the latest gizmos that seem to be destined to conquer the world but they have one really serious downside, just like any other digital battery-powered device – they have to be charged almost on a daily basis. The solution to this problem seems to be nearer than ever though – a...

GELID debuts the Tranquillo Rev. 4 CPU cooler

GELID debuts the Tranquillo Rev. 4 CPU cooler

The GELID Tranquillo rev 3.0 CPU cooler, which was released in fall 2014, has finally gotten an update in the form of a new CPU cooler called Tranquillo Rev. 4. The people at GELID say that the Tranquillo Rev. 4 has improved on the Tranquillo Rev. 3 in almost any aspect and we have every reason...

Mushkin launches new DDR3-2800 memory

The US memory maker Mushkin has released new DDR3 memory that runs at 2800 MHz. The new company product occupies two Mushkin lines – the Redline Series and Stealth Series and comes in modules with total capacity of 4 GB. The memory runs at 2800 MHz clock speed, comes with...

Leave a comment