Super Talent Develops Green DDR3 Memory

super-talent-ddrSuper Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, developed a new line of green DDR3 modules that use 38% less PCB material and 47% less packaging material than the company’s standard DDR3 DIMMs.

In this product line Super Talent has taken two major steps toward developing more eco-friendly DRAM. Using JEDEC standard schematics Super Talent developed very low profile (VLP) DDR3 unbuffered DIMMs for use in standard DDR3 based x86 motherboards. These DIMMs use 38% less FR4 material, which is the fiber glass epoxy substrate most PCBs are made of, and one-third less copper. These DIMMs have already been tested exhaustively with a variety of hardware and software to ensure they meet Super Talent’s rigid quality standards, and are backed with Super Talent’s lifetime warranty.

VLP vs Std pkg comparison

Super Talent also redesigned their package for these green DIMMs to use about half as much plastic in a clamshell that occupies 57% less volume. These reductions in material usage result in a packaged module that weighs 35% less than a standard DDR3 packaged DIMM, which translates to significant savings in shipping costs.

Standard DDR3

Green DDR3

% Improvement

HeightDIMM

30.1mm

18.8mm

38%

LengthPkg

175mm

161mm

8%

WidthPkg

57.9mm

46.9mm

19%

HeightPkg

13.0mm

7.6mm

42%

WeightPkg

15.0g

8.0g

47%

WeightDIMM+Pkg

30.4g

19.8g

35%

VLP-vs-Std_comparison-2

“Our goal with these green DDR3 DIMMs is to offer a greener memory choice for regular desktops that uses less raw materials, produces less industrial waste and consumes less fuel to transport with absolutely no tradeoffs in functionality or price”, explained Super Talent Director of Marketing, Joe James. “When multiplied by the hundreds of thousands of memory modules we produce monthly, this can have an enormous environmental impact.” Super Talent’s first green 1066 and 1333 MHz 1GB and 2GB DIMMs will begin shipping in September.

Source: Super Talent

Related posts

EVGA X58 FTW3 mainboard Revealed

EVGA has announced a new high-end motherboard based on Intel X58/ICH10R chipset combo - EVGA X58 FTW3.  The motherboard is a standard ATX form factor and takes the popular EVGA X58 SLI design, features 2 SATA 6Gb/s ports, 2 USB 3.0 ports, 6 DIMM slots - supporting Triple-Channel DDR3 Memory...

Cooler Master updates its Swift-RX mouse pad line

Cooler Master updates its Swift-RX mouse pad line

Cooler Master has decided to update its Swift-RX mouse pad line by adding an entirely new model to the series – the extra large Swift-RX mouse pad that complements and completes the Swift-RX line. The new Extra Large Swift-RX model measures 900 x 360 mm and is for people to whom regular mouse...

LG launches Xnote A540 notebooks

LG has launched three new notebooks that belong to the Xnote series and will sell under the A540 model name. The new notebooks will be available in South Korea at first with a worldwide market debut later this month. All three new models come with stereoscopic displays and do not need...

Leave a comment