MediaTek announces three new chips for mobile devices
CES 2016 has become the birthplace of three new chips for mobile devices, developed by the popular chip maker MediaTek. The chips are called MT2523, MT7697 and MT8581 and target different markets as initially expected.
The MediaTek MT2523 chip is aimed at smartwatches. The new System-in-Package (SiP) processor offers a GPS receiver, dual-mode Bluetooth Low Energy and a MIPI-supported high-resolution mobile screen for active and fitness smart watches. The chip’s printed circuit board area is 41 per cent smaller than other competitor’s solutions and packs a microcontroller unit (MCU) as well as a power management unit (PMU). In addition the chip includes 2D capabilities of true color, per pixel alpha channel and anti-aliasing fonts, plus 1-bit index color to save memory and computing power. MediaTek claims the MT2523 offers more than a week of battery life on a single charge.
The MediaTek MT7697 is designed for smart devices and wearables and features high levels of integration and impressively low power consumption. The chip supports both BLE and Wi-Fi connectivity with BLE used for short range connectivity while Wi-Fi is for long range. There’s a dual-band Wi-Fi version of this chipset as well – called MT7697D, the chip offers 2.4 GHz and 5 GHz support.
The last chip, called MediaTek MT8581 is designed to power Blu-ray, DVD and CD playback and comes with support for Ultra-HD and HDR imaging for greatly improved display clarity and contrast. The chip also allows users to both scale up to 4K from DVD and scale down to a non-4K display to accommodate both legacy and cutting-edge screens and discs. In addition to this the MT8581 supports HEVC, H.264 and VP9 4K 60p video decoder for 4K (3840 x 2160 pixels) video content and also MPEG-2, VP8 and VC-1 2K 60p video decoder for legacy 2K (1920 x 1080 video content) as well as Advanced Audio Coding (AAC), Dolby Digital, Dolby Digital Plus, Dolby TrueHD, DTS, and DTS-HD master audio, via multi-format decoding.
The first two chips will be available from OEMs in H1 2016, while the last one – the MT8581 – will be on the market in H2 2016.