The Korean tech giant Samsung has announced that it now mass produces the industry’s first ePoP (embedded package on package) memory. The new type of memory includes 3 GB of LPDDR3 DRAM, 32 GB of eMMC (embedded multi-media card) memory and a controller.
This news may not be that exciting but in fact it is – the new ePoP memory is extremely thin and it combines all essential memory components into a single package that can be put on top of the mobile processor with no additional space needed. Thus the new memory saves a lot of space that can be then put to other use. The new memory is also fast – the 3 GB of LPDDR3 mobile DRAM runs at an I/O data transfer rate of 1,866 Mb/sec and sports a 64-bit I/O bandwidth.
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics, has said. “We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”
The new memory will be used in a wide range of smartphones soon, maybe even by the end of the year. Unfortunately the ePoP memory is expensive and will be used in high-end smartphones only as of now.
Source: Samsung