A-Data intoros XPG Gaming Series DDR3-2000G kits

A-Data reveals a new DDR3 modules, designed for game lovers – the new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0. The modules use high quality 2oz copper 8 layers PCB, equipped with aluminum heat spreaders  and promised to deliver CL9-9-9-24 timing at 1.55V-1.75 voltage .

“A-DATA is the leader in the reliable and high performance DRAM module,” said Richard Shen, manager of A-DATA product management department. “Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can relay on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.”

A-Data XPG Gaming Series DDR3-2000G


Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 8 layers PCB (Printed Circuit Board).
  • Equipped aluminum heat spreaders to perform heat away from DRAM module.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 2oz copper 8 layers PCB (Printed Circuit Board):
  • Assist spreading of heat from critical areas to perform effective thermal cooling.
  • Decrease the resistance of electronic flow to avoid electric waste.
  • Increase DRAM module’s lifetime.
  • Improve signal integrity.
  • Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
  • Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
  • Feature Extreme Memory Profiles.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

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