A-Data intoros XPG Gaming Series DDR3-2000G kits

A-Data reveals a new DDR3 modules, designed for game lovers – the new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0. The modules use high quality 2oz copper 8 layers PCB, equipped with aluminum heat spreaders  and promised to deliver CL9-9-9-24 timing at 1.55V-1.75 voltage .

“A-DATA is the leader in the reliable and high performance DRAM module,” said Richard Shen, manager of A-DATA product management department. “Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can relay on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.”

A-Data XPG Gaming Series DDR3-2000G


Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 8 layers PCB (Printed Circuit Board).
  • Equipped aluminum heat spreaders to perform heat away from DRAM module.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 2oz copper 8 layers PCB (Printed Circuit Board):
  • Assist spreading of heat from critical areas to perform effective thermal cooling.
  • Decrease the resistance of electronic flow to avoid electric waste.
  • Increase DRAM module’s lifetime.
  • Improve signal integrity.
  • Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
  • Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
  • Feature Extreme Memory Profiles.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Related posts

Intel Broadwell chips may emerge sooner than expected

There might be some good news for computer hardware fans and enthusiasts – a new piece of information now claims that the first Intel processors on 14 nm technology, codenamed Broadwell, will emerge sooner than expected – in Q3 2014. Previously the Intel CEO Brian Krzanich reported that...

Nintendo Fusion specs leaked online

The failing PC market and the appearance of new gaming consoles such as Xbox One and PlayStation 4 may mean that most gamers will switch to consoles in the near future. This may sound like good news to some people but not for Nintendo for sure as the Japanese company has failed to present...

BenQ adds T1260 HDR touch screen camera

A week ago BenQ has announced E1260 HDR Camera, now expands its digital camera lineup with the T1260 HDR (High Dynamic Range) camera. The "T" in this model, means of course "touch screen",  featuring also a 12 Megapixels sensor,  28mm 4x optical wide angle zoom lens; capability of shooting...

Leave a comment