A-Data intoros XPG Gaming Series DDR3-2000G kits

A-Data reveals a new DDR3 modules, designed for game lovers – the new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0. The modules use high quality 2oz copper 8 layers PCB, equipped with aluminum heat spreaders  and promised to deliver CL9-9-9-24 timing at 1.55V-1.75 voltage .

“A-DATA is the leader in the reliable and high performance DRAM module,” said Richard Shen, manager of A-DATA product management department. “Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can relay on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.”

A-Data XPG Gaming Series DDR3-2000G


Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 8 layers PCB (Printed Circuit Board).
  • Equipped aluminum heat spreaders to perform heat away from DRAM module.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 2oz copper 8 layers PCB (Printed Circuit Board):
  • Assist spreading of heat from critical areas to perform effective thermal cooling.
  • Decrease the resistance of electronic flow to avoid electric waste.
  • Increase DRAM module’s lifetime.
  • Improve signal integrity.
  • Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
  • Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
  • Feature Extreme Memory Profiles.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Related posts

A-Data launched 2.5'' to 3.5'' Hard Drive Converter

A-DATA Technology Co., Ltd., a worldwide leader in high performance memory products, announced today that it has launched A-DATA XPG 3.5” SSD Enclosure to expand its portfolio of SSD solutions. This device is an ingenious hard drive converter, turning up to two 2.5” SATA SSDs into a 3.5” SATA...

BenQ RL2240H - World’s First Monitor for real-time strategy games

The company BenQ has unveiled another gaming monitor, in addition to their first-person shooter optimized model XL2410. The new model is called BenQ L2240H and is claimed to be world’s first monitor which is  specifically designed for Real-Time Strategy (RTS) gaming. The new 22-inch monitor...

Intel may be forced to delay thinner production processes

Intel may be forced to delay thinner production processes

It has been more than a year since we began to talk actively about Intel’s 14 nm desktop Broadwell processors but they are nowhere to be seen. Expected sometime in 2015 the chips may suffer additional delays due to difficulties that Intel faces with the production of these very advanced chips...

Leave a comment