The world leader in advanced memory technology, Samsung Electronics, announced that it has developed the first 32 Gigabyte performance enhancing, load reduced and dual inline memory module for server applications (LRDIMM) in the industry
Read moreSamsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world’s thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially... Read more
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced shipment of its 32-Gigabyte (GB) moviNANDTM, the highest density embedded memory card utilizing advanced 30-nanometer (nm) class process... Read more