A-Data intoros XPG Gaming Series DDR3-2000G kits

A-Data reveals a new DDR3 modules, designed for game lovers – the new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0. The modules use high quality 2oz copper 8 layers PCB, equipped with aluminum heat spreaders  and promised to deliver CL9-9-9-24 timing at 1.55V-1.75 voltage .

“A-DATA is the leader in the reliable and high performance DRAM module,” said Richard Shen, manager of A-DATA product management department. “Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can relay on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.”

A-Data XPG Gaming Series DDR3-2000G


Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 8 layers PCB (Printed Circuit Board).
  • Equipped aluminum heat spreaders to perform heat away from DRAM module.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module

  • All DRAM IC are verified by high standard criteria.
  • High quality 2oz copper 8 layers PCB (Printed Circuit Board):
  • Assist spreading of heat from critical areas to perform effective thermal cooling.
  • Decrease the resistance of electronic flow to avoid electric waste.
  • Increase DRAM module’s lifetime.
  • Improve signal integrity.
  • Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
  • Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
  • Feature Extreme Memory Profiles.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Related posts

Porta-Pilots

Porta-Pilots

No matter how you look at Porta-Pilots, this is one unusual Google Play game for Android devices. The game is a large one at 100+ MB in size but you will soon see that the app will pay off. This free Android app is nothing like most games that you can find on Google Play. It starts as a movie...

Colorful works on factory overclocked GeForce GTX Titan

Just a week after the launch of the GeForce GTX Titan market availability is abundant with names such as ASUS, MSI, Gainward, Gigabyte, Palit and other companies selling their own versions of the card. They all share something in common though - stock frequencies. This will...

Nokia's new Digital Radio Headset

Nokia announces a new accessory for the Nokia N8, C7 and other Symbian^3 teammates, which utilize the phone's USB-On-The-Go feature to add extra hardware and software features. The DAB digital radio headset measures 55 x 23 x 14.5mm and weighs 30.5g, it offers a much clearer reception...

Leave a comment