Huawei to debut Ascend D3 smartphone
The Chinese Huawei will unveil a new smartphone on February 24 during the Mobile World Congress 2014 with the device being called Ascend D3. It will be Huawei’s flagship smartphone for the time to come.
The Ascend D3 comes with a thin chassis that is just 6.3 mm thick. The device has a 28 nm Kirin 920 processor with eight computational cores that run at 1.8 GHz. The chip can also make use of the big.LITTLE architecture, which means that four cores can process simple tasks, while the other four can concentrate on more complex chores.
The rest of the specs of this device include a 5-inch sensor display at Full HD resolution, a rear 16 MP camera and Android 4.3 Jelly Bean. The pricing of the smartphone is not known as of now.