Intel Broadwell chips may emerge sooner than expected

There might be some good news for computer hardware fans and enthusiasts – a new piece of information now claims that the first Intel processors on 14 nm technology, codenamed Broadwell, will emerge sooner than expected – in Q3 2014.

Previously the Intel CEO Brian Krzanich reported that the first Broadwell processors will arrive in late 2014 and possibly in 2015 citing problems with the 14 nm manufacturing process as well as the overall PC market situation. It appears now that the US chip giant is either making good progress in the 14 nm tech field or thinks that the time to release Broadwell is around the back to school season in late summer. Still bear in mind that the information, circulated by a few web sites, has in no way been confirmed and may not be true.

Broadwell will not bring major architectural improvements although there surely will be some. Instead being made on a thinner process the chip will focus on energy efficiency and a better integrated GPU. Even if Intel releases Broadwell this year the majority of processors manufactured will belong to the Haswell family so if you need a new computer just go ahead and buy a Haswell chip – after all Broadwell may not come out this year or in sufficient quantities to purchase one.


Source: KitGuru

Related posts

Alcatel releases 7-inch ICS tablet

Despite the abundance of all kinds of tablets on the market, the French company Alcatel, known so far for its mobile phones, has decided to release a company tablet that will be known as Alcatel OneTouch T10. The new tablet comes with a 7-inch sensor display (800 x 480 pixel...

Cooler Master prepares GXII PSUs

Cooler Master prepares GXII PSUs

Cooler Master has prepared one more power supply unit line. The novelty is known with the rather short GXII v2.0 name and includes three models with power output of 450W, 550W and 650W. All new PSUs come with 80 Plus Bronze certification, which means that they offer at least 81 per cent...

Samsung Develops Thinnest ulti-die Memory Package

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is...

Leave a comment