The Helio X30 processor will be an exciting new product that MediaTek will release this year. The chip was announced back in March when the MediaTek CEO claimed it would present Samsung and Qualcomm with some serious competition but it is now almost August and no such chip has been announced.
Fortunately we now have the first technical details of the Helio X30. They come from the company’s Chief Operations Officer so we can say with confidence that the information is reliable. According to the COO, the Helio X30 will be made by TSMC and will use an ultra modern 10 nm production process. The chip will support LTE Cat 10 and LTE Cat 12 as well as up to 26 MP cameras. In addition MediaTek has abandoned the Mali GPUs – instead the Helio X30 will come with a PowerVR 7XT GPU, which will provide more processing power and better energy efficiency.
The MediaTek Helio X30 will arrive with two Cortex-A73 cores, called Artemis that will run at 2.8 GHz, four Cortex-A53 cores at 2.2 GHz and four Cortex-A35 cores that will function at 2 GHz. The Helio X30 processor will also support up to 8 GB of LPDDR4 memory and UFS 2.1 technology.
The first smartphones on the SoC Helio X30 are expected in mid-2017.
Source: MediaTek