Silicon Power Releases DDR3-1333/1066 Dual Channel Pack

Silicon-Power-DDR3-1333-1066-Dual-Channel-PackIf you have recently upgraded to an Intel Core i7 or AMD AM3 platform PC and does not know what is the perfect memory module match for your high end system? The answer to your solution is Silicon Power’s DDR3-1333/1066 dual channel memory module packs. Silicon Power’s DDR3-1333/1066 dual channel memory module packs not only support the new Intel / AMD platforms but also Intel’s Core i7 Quick Path Interconnect (QPI) technology boosting bandwidths up to 6.4GB/s. It is best suited for gaming, HD multimedia, intense graphic and video editing / processing work.

Silicon Power’s DDR3-1333 /1066 memory modules are in compliance with JEDEC DDR3 standards. Using the new Fly-by circuit design for efficient communications between DRAM modules and the controller; its On-DIE Termination (ODT) technology dramatically reduces unwanted reflection signals and maximizes speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer. Tested 100% proof for dual channel operation, Silicon Power’s dual channel DDR3 memory pack is stable, durable and highly compatible.

Silicon Power DDR3-1333-1066 Dual Channel Pack

Silicon Power’s DDR3-1333/1066 dual channel memory pack is available in 4GB (2GB x 2) and 2GB (1GB x 2) variants for users to choose from. It is in compliance with RoHS standards, comes with a complete after-sales service and lifetime warranty.

Product features

New generation memory module, effectively reduces power consumption by 20% ~ 30%

Original 128Mx8 FBGA modules for better heat dissapation

Uses Fly-by circuitry design for efficient communications between DRAM modules and the controller

On-DIE Termination (ODT) technology dramatically reduces unwanted reflection signals and maximizes speed

Uses original memory modules, FBGA packaging and ruggedly tested under dual channel operation

Stable, durable and highly compatible

Product specifications

Memory type: DDR3 Memory

Memory pin: 240Pin Long-DIMM

Operating frequency: DDR3-1333MHz / DDR3-1066MHz

Mode of operation: Unbuffer Non-ECC Memory

Capacity: 4GB(2GB*2) / 2GB(1GB*2)

Module: 128Mx8 (bit) (single module)

Operating voltage: 1.5 V

Cas latency:9 (1333MHz) / 7 (1066MHz)

Warranty: Lifetime

Source: Silicon Power

Related posts

Harmon Kardon launches SB16 home cinema soundbar system

Harmon Kardon launches SB16 home cinema soundbar system

Harmon Kardon has introduced a new 2.1 home theater soundbar, which includes single amplified loudspeaker unit taht can be connected directly to your television, DVD player or game console, and a single wireless subwoofer that you may place anywhere in the room. The soundbar called  SB16...

Samsung Galaxy S3 gets a competitor

The Samsung Galaxy S3 has a pretty strong case in its quest to get the “Smartphone of the Year” award, but surprisingly enough the tech masterpiece will soon be challenged by another smartphone not produced by a big name in this industry! The Galaxy S3 challenger hails from another...

Qualcomm presents four new SoC platforms

Qualcomm presents four new SoC platforms

Qualcomm has announced no fewer than four new company systems-on-chip (SoC) platforms and these include the Snapdragon 620, 618, 425 and 415. All of them are based on well-known ARM technology and include some interesting features. The higher the number the more powerful the chip is so we...

Leave a comment