AMD to release new notebook APUs soon

AMD to release new notebook APUs soon

There’s one thing that we have to admit when it comes to AMD – despite losing the high-end CPU market to Intel, the Sunnyvale, California-based chip company keeps its hold on the budget market by being pretty strict in its APU release schedules where new models come one after another. This fact holds true for the current generation Kabini chips too – they will soon be replaced by newer Carrizo processors.

Carrizo will be AMD’s response to the upcoming invasion of low power Intel Broadwell processors and the Core M chip. While we do not expect Carrizo to set new records, the architecture should provide increased performance and a bunch of new features. This is the place to say that Carrizo will arrive in two batches with the first one being the so-called Carrizo-L, which will launch in December 2014 to replace the current Beema and Mullins processors and the second one being regular Carrizo chips that will come out in March 2015. Both batches will compete with Intel Celeron and Pentium processors.

The specs of Carrizo are still not known well but according to some reports Carrizo will feature two or four Excavator processing cores, depending on the model, support for DDR3-2133 memory and 28 nm production process. The chips will fully support Windows 8, Windows 8.1 and Windows 10 as well as Linux Ubuntu and SLED operating systems. The new processors may even have an ARM micro-core somewhere inside, which handles data security.

Source: News.Softpedia.com

Related posts

Grand Sphere

Grand Sphere

Grand Sphere is one of those Google Play apps where you have to invest some time and effort in order to learn how to play them. So if you don’t have these two resources, don’t download this game. Actually the idea behind Grand Sphere is not a bad one – in fact we would call it great! The game...

Sony Develops World's First Millimeter-wave Wireless Intra-Connection Technology for Internal High Speed Data Transfer within Electronics Products

Sony Corporation ('Sony') today announced the development of millimeter-wave wireless intra-connection technology that realizes high speed wireless data transfer inside electronic products such as television sets. By replacing complicated wires and internal circuitry with wireless connections...

TDK announces SDG4A solid-state drives

The Japanese corporation TDK has announced a new line of 2.5-inch form factor SSDs – the SDG4A. The new SSD line is suitable for industrial applications and provides ultimate reliability in extreme conditions. The new SSD line will shortly be available in three capacities –...

Leave a comment